William A. Koepf

William A. Koepf

Director/ Co-Interim Associate Dean - College of Engineering Technology
School of Engineering & Computing Technology & School of Design & Manufacturing
School of Engineering and Computing Technology
Phone: (231) 591-5040
Email: [email protected]

Education

• MS, Western Michigan University, Engineering Management
• BS, Ferris State University, Product Design Engineering Technology
• AAS, Ferris State University, Technical Drafting Tool Design

Biography

I grew up in the thumb are of Michigan and attended the Unionville-Sebewaing Area high school. I graduated from Ferris with an A.A.S. degree in Cad Drafting & Tool Design and a B.S. degree in Product Design Engineering Technology in 1991. I spent almost 10 years in the automotive injection molding industry as a designer, project engineer, manufacturing engineer and manufacturing manager. These roles were held within 2 different parent companies so while I did shift jobs, I only changed companies once before coming to Ferris as an Instructor in the Fall of 2000. I returned to school at Western Michigan University where I completed by M.S. degree in Engineering Management. I taught in the PDET program for approximately 22 years. In that time I served many years as the program coordinator and am now serving in several administrative roles.

Publications and Intellectual Contributions

• Journal Article
  Liu, Y., O'Connor, R. A., VandeVeegaete, N., O'Connor, K., Koepf, W. A. (2024). "Empowering Tomorrow’s Automotive Workforce: Cutting-Edge Electric Vehicles Certificate and Battery Center," https://ieeexplore.ieee.org/xpl/conhome/10569139/proceeding. Opatija, Croatia: IEEE Explore. https://ieeexplore.ieee.org/document/10569558/authors#authors
• Magazine/Trade Publication
  Liu, Y., Leonard, R. A., VandeVeegaete, N., O'Connor, K., Koepf, W. A. (2024). "Empowering Tomorrow's Automotive Workforce: Cutting Edge Electric Vehicles Certificate and Battery Center," IEEE Xplore 2024 47th MIPRO ICT and Electronics Convention. New York City, New York: IEEE. • https://ieeexplore.ieee.org/document/10569558